IEEE Fellow

Recognizing the achievements of its members is an important part of the mission of the Institute of Electrical & Electronics Engineers (IEEE). Each year, following a rigorous evaluation procedure, the IEEE Fellow Committee recommends a select group of recipients for elevation to IEEE Fellow.

Photo of Ed Godshalk

Edward Godshalk, PhD

Engineer-in-Residence
Industrial Advisory Board, member

egodshalk@georgefox.edu

Elevated to IEEE Fellow for the development of microwave on-wafer probing and measurement techniques

Biography

Edward Godshalk has been an avid student of RF and microwave technology since junior high school, when he built a spark gap transmitter in his basement.  He obtained his BA in Physics from Monmouth College, Illinois, in 1982 and the BS and MS, both in electrical engineering, from Washington University in St. Louis in 1982 and 1983, studying under the late Fred Rosenbaum.

Ed joined Central Microwave in 1983, where he designed advanced microwave integrated circuit oscillators at millimeter wave (mmW) frequencies.  In 1985 he joined Millitech Corp. in Massachusetts where he developed the world’s first commercial turn-style circulators above 110 GHz and a digital radio product line up to 135 GHz, a record at the time.  He also built state-of-the-art mmW oscillators for the Jet Propulsion Lab’s Upper Atmospheric Research Satellite launched to map the ozone layer in response to the discovery of the chlorofluorocarbon threat. 

In 1989, Ed moved to the west coast and joined Cascade Microtech in Beaverton, where he invented the world’s first commercial waveguide input probe, enabling pioneering measurements of on-wafer devices above 65 GHz, facilitating the first generation of mmW monolithic microwave ICs (MMICs).  Next, he invented the air coplanar (ACP) wafer probe to replace the first generation of wafer probes, which had fragile ceramic tips and high insertion loss.  The ACP was introduced in 1994 and is still in production, making it one of the most successful and imitated wafer probes in the industry.  The ACP’s rugged but compliant low loss probe tips allow it to probe both on-wafer devices and printed circuit boards. 

From 1994-96, Ed worked at Tektronix, then started his own business, Redpoint Microwave, in 1996.  He received his PhD in 1998 from Oregon State University, where he studied with the late Vijay Tripathi.  In 1997, Ed had joined Maxim Integrated and founded the Electromagnetics Group, which performs measurements, modeling and simulation from DC to mmW frequencies.  His group was a critical resource in advancing on-die devices and ICs for applications ranging from DC-DC converters to 100 Gbps fiber optic links.

Dr. Godshalk retired from Maxim in December 2019 and is now an Engineer-in-Residence at George Fox University in Newberg, Oregon, where he teaches microwave theory and technology to the next generation of engineers.  He is assisting local start-up companies to help promote more high-tech job opportunities in the region. He also owns Redpoint Microwave LLC, which specializes in measurements and components at RF and microwave frequencies.

Top Five (5) Publications

  1. “A V-Band Wafer Probe Using Ridge-Trough Waveguide,” E.M. Godshalk, IEEE Trans. Microw. Theory Techn., Vol. 39, No. 12, pp. 2218-2228, Dec. 1991.
  2. “An Air Coplanar Wafer Probe,” Edward M. Godshalk, Jeremy Burr, and Jeff Williams, 43rd Automatic RF Techn. Group Conf., San Diego, CA, May 27, 1994.
  3. “Surface Wave Phenomenon in Wafer Probing Environments,” E.M. Godshalk, 40th Automatic RF Techn. Group Conf., Orlando, FL, Dec. 1992.
  4. “Modeling Ground Signal Probe Invasiveness and its Effect on Extracted Inductor Q,” Edward M. Godshalk and Garth Sundberg, 59th Automatic RF Techn. Group Conf., Seattle, WA, June 2002.
  5. “Best Practices for Reducing Electromagnetic Interference on Power Converters,” E.M. Godshalk, Maxim Integrated Internal Report, 59 pp., June 26, 2017.

Selected Patents

  • Ridge-Trough Waveguide: U.S. Patent 4,992,762.
  • Air Coplanar Waveguide Wafer Probe: U.S. Patent 5,506,515.
  • Non-Invasive Microwave Analysis Systems: U.S. Patent 7,164,105.
  • Bragg Mirror Optimized for Shear Waves: U.S. Patent 7,684,109 B2.
  • Optimal Acoustic Impedance Materials for Polished Substrate Coating to Suppress Passband Ripple in BAW Resonators and Filters: U.S. Patent 8,512,800 B2.
  • Methods of Contacting the Top Layer of a BAW Resonator: U.S. Patent 7,567,024 B2.
  • Inductors Having Inductor Axis Parallel to Substrate Surface: U.S. Patent 8,344,478 B2.
  • Semiconductor Device Having Trench Capacitor Structure Integrated Therein: U.S. Patent 9,608,130 B2.